Vishay推MAP封裝298D系列固體鉭芯片電容
——
作者:
時間:2007-08-14
來源:EEPW
通過充分利用已獲專利的MAP(多陣列封裝)裝配技術,Vishay的298DMicroTan電容器已得到擴展,可在面積為1.60mm
相關推薦
-
-
| 2010-01-18
-
| 2009-07-06
-
| 2009-07-06
-
| 2009-07-06
-
| 2009-10-26
-
-
| 2002-12-31
-
-
| 2002-08-06
-
| 2007-12-11
-
-
| 2009-07-06
-
| 2002-08-25
-
| 2007-12-24
-
| 2007-12-19
-
| 2007-12-16
-
| 2010-01-18
-
| 2010-01-18
-
| 2002-11-27
-
-
| 2002-07-15
-
| 2010-02-10
-
| 2007-12-20
-
| 2009-07-06





評論